By Madhusudan Iyengar
To rejoice Professor Avi Bar-Cohen's sixty fifth birthday, this special quantity is a suite of modern advances and rising learn from a variety of luminaries and specialists within the box. state-of-the-art applied sciences and learn concerning thermal administration and thermal packaging of micro- and nanoelectronics are lined, together with more advantageous warmth move, warmth sinks, liquid cooling, section swap fabrics, artificial jets, computational warmth move, electronics reliability, 3D packaging, thermoelectrics, information facilities, and stable country lighting fixtures.
This booklet can be utilized by means of researchers and practitioners of thermal engineering to realize perception into subsequent new release thermal packaging ideas. it truly is a superb reference textual content for graduate-level classes in warmth move and electronics packaging.
Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, machine engineering, and electric & digital engineering.
Read or Download Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging) (Volume 3) PDF
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